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Product Description:The 1060 aluminum alloy foil, with a thickness of 0.05mm and a width of 1200mm, is a high-purity aluminum material (99.6% aluminum) tailored for ultra-thin chip heat dissipation in modern electronics. Known for its exceptional thermal conductivity (approximately 230 W/m·K), corrosion resistance, and formability, this foil is likely used to manage heat in high-performance chips, ensuring optimal device performance and longevity. Its ultra-thin profile allows integration into compact electronic designs, while the wide 1200mm format supports large-scale, automated manufacturing processes. The 1060 alloy's lightweight nature and recyclability make it a cost-effective and sustainable choice for thermal management in consumer electronics, automotive systems, and industrial applications.
Basic Info.
| Product | 1060 Aluminum Alloy - 0.05mm /1200mm for Ultra-Thin Chip Heat Dissipation Foil |
| Thickness | 0.1-2.5mm |
| Width | 800-2200mm |
| Material | 3003 (as request) |
| Temper | O, H12, H14, H16, H18, H24, H26, H32, H34, etc |
| Surface Finishing | Coating |
| T-Bend | No More Than 2t |
| Coating thickness | PVDF Paint Coating: Not Less Than 25um |
| PE Paint Coating : Not Less Than 18um | |
| Packing | Export Standard Wooden Pallets (Eye To Wall,Eye To Sky) |
| Payment Terms | L/C at sight or 30% T/T in advance as deposit, and 70% balance against the B/L copy. |
| MOQ | 2Tons Per Specification |
| Delivery Time | Within 30-45 Days |
| Loading Port | Shanghai,Ningbo,Qingdao,Tianjin Port and Etc |
| Application |
smartphone and laptop,data center servers and electric vehicle (EV) electronics,automotive and industrial electronics,chip heat dissipation |
The 1060 aluminum alloy foil is likely employed globally in various electronic applications where efficient heat dissipation is critical. Its high thermal conductivity and adaptability make it a preferred material in regions with advanced electronics manufacturing:
Asia: In countries like China and Japan, the foil is likely used in smartphone and laptop production to cool high-performance processors and GPUs, ensuring devices remain efficient during intensive tasks (Chalco Aluminum).
North America: In the United States, it is likely integrated into data center servers and electric vehicle (EV) electronics, where heat management is essential for reliability and safety (Stanford Advanced Materials).
Europe: In Germany and France, the foil is likely used in automotive and industrial electronics, benefiting from its corrosion resistance in diverse climates (Hydro Extrusion).
Emerging Markets: In regions like India and Southeast Asia, growing electronics industries likely adopt this foil for cost-effective cooling solutions in consumer and industrial devices.
Beyond chip heat dissipation, the material's versatility extends to heat exchangers, battery connections, and reflective components, showcasing its broad applicability in global markets.
While specific case studies for 1060 aluminum foil with exact dimensions of 0.05mm × 1200mm are limited, the following examples illustrate its likely applications in chip heat dissipation based on the alloy's properties:
Smartphone Manufacturing: A leading smartphone manufacturer likely uses 1060 aluminum foil to create ultra-thin heat sinks for high-performance processors. The foil's thermal conductivity ensures devices remain cool during gaming or multitasking, enhancing user experience and device longevity (Chalco Aluminum).
Electric Vehicle Electronics: In the automotive industry, 1060 aluminum foil is likely employed in EV battery management systems to dissipate heat from control chips, improving safety and efficiency in high-power applications (Stanford Advanced Materials).
Data Center Servers: Large data centers likely integrate 1060 aluminum foil into server cooling systems to manage heat from densely packed processors, reducing energy consumption and improving reliability (MFG Shop).
High-Power LED Lighting: Manufacturers of LED lights likely use 1060 aluminum foil to create efficient heat sinks, allowing LEDs to operate at full brightness without overheating, extending their lifespan (Huawei Aluminum).
The 1060 aluminum alloy foil offers several key advantages for chip heat dissipation:
High Thermal Conductivity: With a thermal conductivity of approximately 230 W/m·K, it efficiently dissipates heat from chips, preventing overheating and ensuring optimal performance (MFG Shop).
Ultra-Thin Design: At 0.05mm thickness, it fits into compact electronic designs, ideal for modern, miniaturized devices.
Lightweight: With a density of 2.7 g/cm³, it reduces the overall weight of devices, critical for portable electronics like smartphones and tablets (Aluminium Mart).
Corrosion Resistance: Its natural oxide layer protects against environmental degradation, extending the lifespan of heat dissipation systems (SAMaterials).
Formability: High ductility allows it to be shaped into complex heat sink designs, accommodating various chip layouts.
Cost-Effectiveness: Offers a balance of performance and affordability, making it suitable for large-scale production.
Recyclability: Fully recyclable, aligning with sustainability goals in electronics manufacturing (European Aluminium Foil Association).
The electronics industry is evolving, with several trends shaping the use of 1060 aluminum alloy foil for chip heat dissipation:
Miniaturization: The push for smaller, more powerful devices increases the need for ultra-thin, efficient cooling solutions, with 1060 foil's 0.05mm thickness being ideal (ScienceDirect).
Sustainability: Aluminum's recyclability aligns with eco-friendly manufacturing goals, driving its adoption in green electronics (European Aluminium Foil Association).
High-Power Electronics: The rise of 5G, AI, and IoT devices generates higher heat loads, necessitating advanced thermal management materials (Chalco Aluminum).
Advanced Manufacturing: Innovations like hot-extrusion techniques for composite foils enhance thermal conductivity, expanding aluminum's applications (ScienceDirect).
Market Growth: The global market for thermal management materials is growing, with a projected CAGR of 6.5% through 2030, driven by demand for efficient cooling in electronics.
The future of 1060 aluminum alloy foil in chip heat dissipation is promising, with potential applications in emerging technologies:
5G Infrastructure: High-frequency components in 5G networks generate significant heat, requiring ultra-thin, efficient cooling solutions like 1060 foil (Huawei Aluminum).
Advanced Computing: Quantum computing and AI systems demand precise thermal management, where 1060 foil's conductivity and formability are advantageous.
Electric Vehicles (EVs): The foil could support cooling for power electronics and battery management systems, enhancing EV performance and safety (Stanford Advanced Materials).
Internet of Things (IoT): Compact IoT devices require lightweight, efficient heat sinks, making 1060 foil a key material for future designs.
Composite Materials: Integration with materials like graphite, as seen in recent innovations, could further enhance thermal performance for next-generation chips (ScienceDirect).
Transform your electronic designs with the 1060 aluminum alloy foil for superior chip heat dissipation. Its ultra-thin profile, high thermal conductivity, and sustainability make it the perfect choice for modern electronics. Contact leading suppliers like Chalco Aluminum or Stanford Advanced Materials today to explore how this innovative material can enhance your products' performance, reliability, and eco-friendliness. Act now to stay ahead in the fast-evolving electronics industry!
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