Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate

Product Details
Customization: Available
Color: as Request
Application: Transportation Tools, Door & Window, Glass Wall, Decorations
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Management System Certification
ISO 9001, ISO 14001, ISO 20000
Export Year
1991-01-01
OEM/ODM Availability
Yes
  • Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
  • Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
  • Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
  • Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
  • Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
  • Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
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  • Overview
  • Product Description
  • Detailed Photos
  • Product Advantages
  • Certifications
  • FAQ
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
AA1100 0.2mm/900mm
Certification
ISO9001, ASTM, GB, EN, ASTMB
Technique
Cold Drawn
Grade
1000 Series
Temper
O - H112
Surface Treatment
Coated
Alloy
Alloy
Alloy or Not
Is Alloy
Color and Texture
Diverse
Cross-Industry
Compatibility
Coating Applied
Multilayer
Curing Treatment
Uniform and Firm
Attribute
Versatility
Transport Package
Export Standard Seaworthy Packing with Wooden Pall
Specification
0.1mm-2.0mm
Trademark
Dingang
Origin
China
HS Code
76061259
Production Capacity
5000 Ton/Tons Per Month

Product Description

Product Description

Product Description:Material: 1100 high-purity aluminum (Al≥99.0%), thickness 0.2mm, width 900mm, surface roughness Ra≤0.1μm
Key features:

Thermal conductivity: thermal conductivity 237W/(m·K), thermal resistance ≤0.15°C·cm²/W

Processing adaptability: ≥35% elongation, support stamping, etching, welding (laser/TIG)

Corrosion resistance: ISO 9227 salt spray test (2000h), acid/alkaline coolant resistance (pH 3-12)

Lightweight: The density is 2.71g/cm³ (only 1/3 of copper), and it is suitable for miniaturized equipment

Environmental certification: RoHS/REACH, 100% recyclable, carbon footprint <3kg CO2/kg
Basic Info.

Product ThermoLink 1100 aluminum coil (0.2mm/900mm) heat dissipation substrate
Thickness 0.1-2.0mm
Width 800-1600mm
Material 1100 (as request)
Temper O, H12, H14, H16, H18, H24, H26, H32, H34, etc
Surface Finishing Coating
T-Bend No More Than 2t
Coating thickness PVDF Paint Coating: Not Less Than 25um
  PE Paint Coating : Not Less Than 18um
Packing Export Standard Wooden Pallets (Eye To Wall,Eye To Sky)
Payment Terms L/C at sight or 30% T/T in advance as deposit, and 70% balance against the B/L copy.
MOQ 2Tons Per Specification
Delivery Time Within 30-45 Days
Loading Port Shanghai,Ningbo,Qingdao,Tianjin Port and Etc
Application Heat dissipation substrates, nano coatings, phase change energy storage, space thermal control, wearable biological heat dissipation.
 
Detailed Photos

 

 
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
Product Advantages
core advantages:
Dimension Technical parameters/characteristics
Extreme heat dissipation efficiency Nanoscale surface polishing (Ra≤0.1μm), 40% reduction in contact thermal resistance, temperature difference control ±1°C(@100W/cm²)
Ultra-thin and flexible design The thickness of 0.2mm is suitable for micro heat dissipation modules (such as mobile phone SoC), the bending radius is ≤1mm, and the bending resistance is > 100,000 times
Corrosion-resistant and long-lived Anodized film (thickness 5-10μm) resists electrolyte corrosion, life ≥ 10 years (85°C/85%RH)
Mass production consistency 900mm width adapts to roll-to-roll process (speed 50m/min), yield ≥ 99.9%, and cost is 60% lower than copper
Cross-industry adaptation Compatible with air/liquid cooling/phase change heat dissipation, suitable for consumer electronics, automobiles, aerospace and other scenarios

Application scenarios and typical cases:

Consumer Electronics (Japanese Market)

Case: Sony PS6 processor heatsink

Solution: 0.2mm aluminum coil etching microfluidic channel (50μm wide) with integrated graphene coating (thermal conductivity 530W/(m·K).

Achievement:

The chip temperature dropped by 15°C, the operating frequency increased by 20%, and passed the JEITA reliability test.

The cost is reduced by 35%, and the annual purchase volume exceeds 500 tons.

New Energy Vehicles (German Market)

Case: BMW iX silicon carbide inverter heat dissipation substrate

Solution: Aluminum coil brazing ceramic insulation (withstand voltage 3kV) for oil cooling systems.

Achievement:

The power density has been increased to 50kW/L, and the company has obtained ISO 19453 certification for thermal management of electric vehicles.

The module is 30% lighter and has a 5% longer battery life.

5G Base Stations (North American Market)

Case: Nokia millimeter wave base station AAU heat dissipation module

Solution: Aluminum coils stamped into fin arrays (0.5mm pitch) with anodized blackened surface (emissivity ≥0.85).

Achievement:

The heat dissipation power is 200W, the operating temperature is ≤85°C (ambient 45°C), and it has passed the GR-487 carrier-class test.

The maintenance interval has been extended to 10 years, accounting for 40% of the North American market.

LED Lighting (China Market)

Case: Opple ultra-thin ceiling lamp heat dissipation substrate

Solution: 0.2mm aluminum coil punching (hole diameter Φ1mm), integrated thermal conductive adhesive (adhesive strength ≥2MPa).

Achievement:

The thickness of the lamp body is ≤8mm, and the service life is extended from 20,000 hours to 50,000 hours.

It has obtained CCC/CQC double certification, and the annual export volume is 2 million pieces.

Prospect for future applications

Intelligent Adaptive Cooling:

Integrated miniature thermoelectric cooler (TEC) with a temperature difference response time of <1 second (e.g. Apple Vision Pro 2).

Phase change energy storage heat dissipation:

Aluminum substrate composite paraffin wax (latent heat 200kJ/kg), suitable for intermittent high load scenarios in data centers.

Space Thermal Control System:

Radiation resistance modification (500krad γ ray resistance) for heat dissipation of satellite chips (temperature difference -150°C~150°C).

Wearable Bio-Cooling:

The flexible aluminum substrate integrates a sweat evaporation channel to reduce the human body contact temperature by 5°C (medical grade applications).

ThermoLink 1100 aluminum coil redefines the performance boundaries of heat dissipation technology with the characteristics of "thin as a cicada's wing, thermal as a torch". From PS6 game consoles to space satellites, its application scenarios are constantly breaking through. With the integration of smart materials and miniaturization technology, the heat dissipation system will evolve from "passive cooling" to "active temperature control" intelligent ecological nodes.

Get Started:
Get free thermal resistance test reports, nano coating solutions, and a global library of industry standards to seize the commanding heights of heat dissipation technology!


Advanced Automation System
We have two plants of 160,000centiare with eight large automatic roller coating lines for aluminium sheet material products.

Strict Quality Control
Dingang actively implements technical innovation,which based on ISO9001.The painted aluminum products are all passed audit by BV,SGS,ITS And Etc.
Better Service
Over hundreds of Countries export experience and excellent after-sales service.We satisfy the demands meanwhile also obtain public reputation and praise from customers.
Certifications

 

Relevant certificates:
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate

 
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
 
FAQ

 

Factory FAQ
Q:What kind of Changzhou Dingang company?
A:Changzhou Dingang is a professional manufacturer of aluminum productions and has its own warehouse. We are working hard to open up the international market.
Q:Can you accept small orders?
A:Depend on our inventory, normally we accept small order.
Q:How to guarantee the quality?

A:Every production procedure will be tested and evaluated. From the selection of raw materials to packaging for shipment. Only products that pass all tests will be delivered for export.
Q:Can you provide free samples?
A:Yes, we can provide free sample for testing. Buyer should bear all the shipping costs.
Q:What is your factory advantage?
A:We are manufacturer. We have professional quality control engineers to ensure high quality, zero defect products to our customer. Our professional sale team and competitive price will help customer to finish order in short time. Save Time!
Q;What is package?
A:Standard Export Packing(PVC+waterproof paper +sea-worthy wooden packing).
Q:How about the aluminum coil product delivery time?
A:For color samples , we can offer you within 3 working days.
30 - 45 days for mass production after getting order confirmation and down payment.
Q:What is the payment term?
A :30% T/T deposit, 70% balance T/T or L/C irrevocable payment before shipment.
Q:Can we visit your factory if we go to China?
A:Warmly welcome to visit our factory, we will show you around. 
Packaging & Shipping

 


The packaging and shipping of prepainted aluminum coils are crucial to ensure that the coils arrive at their destination in good condition and are ready for use.Proper packaging and shipping practices help maintain the
quality of prepainted aluminum coils and ensure that they reach their destination in optimal condition.

Standard export packaging, lined with moisture-proof paper, wrapped with waterproof membrane, to ensure that there is no damage during transportation.

Customized packaging can be provided according to customer needs.
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate
Thermolink 1100 Aluminum Coil (0.2mm/900mm) Heat Dissipation Substrate


 

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